Jolin Zeng
| Picture | Part Number | Manufacturer | Stock | Action |
|---|---|---|---|---|
 | TMP116NAIDRVR | Texas Instruments | 2,040 |
For TMP116N accuracy, use the N-grade rows: maximum ±0.3°C from −25°C to +85°C at 3.3 V; ±0.4°C from −40°C to +125°C at 3.0–3.6 V; and ±0.5°C over that temperature range at 1.9–5.5 V. The accuracy test uses eight averages and a 1 Hz cycle in an oil bath. The standard TMP116 grade has different limits. Neither grade guarantees the error of the assembled fixture.
For PCB thermal measurement, the sensor reports its die temperature. Copper, board material, contact resistance, airflow and nearby heat sources determine how closely the die follows the target. Thermal isolation can help ambient-air measurement but hinder surface coupling. Define the target node, then compare the production-intent assembly with a suitable reference after thermal equilibrium. Include mounting variation and warm host electronics in the check.
No. TI specifies 3.5 µA typical for a 1 Hz cycle with averaging off, an inactive serial bus and 25°C. At eight averages and 1 Hz with the bus inactive at 25°C, the table gives 16 µA typical and 22 µA maximum. Use the selected configuration when budgeting power and self-heating. More averaging can reduce noise but does not automatically remove absolute error.
By Jolin Zeng
TMP116NAIDRVR is TI's TMP116N-grade digital temperature sensor, rated ±0.3°C max from −25°C to +85°C at 3.3 V. In test fixture temperature sensing, its usefulness depends on the allowed error at the object under test, the supply rail, sampling settings and thermal path. A fine digital reading cannot resolve an uncertain temperature gradient. Approve the sensor grade together with the placement, assembly and comparison procedure that will make its readings meaningful.
Start with the exact ordering identity. Texas Instruments lists TMP116NAIDRVR as the N grade in a six-pin WSON, package code DRV. The shared TMP116/TMP116N datasheet separates the grades in its electrical table. The generic “0.2C” heading on the exact product page should not override that table.
Not in EEPROM words 1–4. TI preprograms EEPROM words 1–4 with a unique identification used for NIST traceability and instructs users not to delete or reprogram them when that traceability is needed. Keep those words intact and store corrections elsewhere if required. A preserved chip identity supports traceability; it does not certify the accuracy or regulatory compliance of a finished instrument.
Provide the full OPN, Texas Instruments as manufacturer, quantity, required delivery date, carrier preference and lot or traceability-document requirements. State whether TMP116AIDRVR may be quoted separately as an engineering-review candidate. Include the approved grade and operating conditions so a family-name substitution is not assumed. Submit these details through the YG GROUP RFQ, then confirm offer-specific availability, terms and documents.
The following limits apply to the silicon temperature measurement. The accuracy test uses eight averages, a 1 Hz conversion cycle and an oil bath. They are not specifications for a complete fixture or its contact with the measured object. TI datasheet, electrical characteristics.
| Temperature and supply conditions | TMP116NAIDRVR: TMP116N grade, maximum error | TMP116AIDRVR: standard grade, maximum error |
|---|---|---|
| −25°C to +85°C at 3.3 V | ±0.3°C | ±0.2°C applies over the narrower −10°C to +85°C range |
| −40°C to +125°C at 3.0–3.6 V | ±0.4°C | ±0.25°C through +105°C; ±0.3°C above +105°C through +125°C |
| −40°C to +125°C at 1.9–5.5 V | ±0.5°C | ±0.4°C |
Table 1: Maximum sensor error by grade, temperature and supply. Source: TI TMP116/TMP116N Rev. A, electrical characteristics and footnotes, page 5. Compiled by YG GROUP.
The full operating range should not be confused with the range of a selected accuracy row. If the fixture must work below −40°C, reopen the relevant table footnote rather than extending these numbers downward. Likewise, a supply with a nominal 3.3 V label needs a defined tolerance before you use a condition stated specifically at 3.3 V.
The output step is 7.8125 m°C per least significant bit. That describes digital resolution, not an approximately ±0.008°C thermometer. Averaging can reduce reading noise; it cannot, by itself, remove grade error or a difference between the sensor die and the test object.
TMP116NAIDRVR measures its own die temperature. The board, contact material, air and nearby components determine how closely that temperature follows the point of interest. For test fixture temperature sensing, name the thermal node first, then choose how to couple the sensor to it.
Figure 1: TMP116NAIDRVR measures its die temperature. Control coupling to the intended target while checking heat from the board and ambient air, then validate the complete fixture against a reference. Source: TI TMP116/TMP116N Rev. A. Compiled by YG GROUP. Evidence: documentation 1.
For a local PCB monitor, heat conducted from a regulator may be useful information. For an ambient-air monitor, the same heat is an unwanted contribution. A cutout that improves isolation for air measurement can obstruct the heat path needed for a surface measurement. There is no universally best copper pattern.
For a fixture touching a solid surface, review board thickness, contact pressure, interface material, air movement and repeatability of placement. If a removable assembly is used, test it after repeated mounting. A good result obtained with one carefully positioned prototype does not establish the error of units assembled by different operators.
The datasheet also contains a specific assembly caution: for high-precision readings on a rigid PCB, TI recommends leaving the thermal pad unsoldered to reduce stress-related error. Soldering may be used for flexible-board reliability; a soldered pad must be floating or connected to ground. The thermal response and calibration consequences still need validation. This instruction should reach the assembly drawing and stencil review, rather than remaining only in an engineer’s notebook. TI datasheet, layout guidance.
In PCB thermal measurement, this makes mechanical and assembly choices part of the sensing BOM. A smaller specified chip error has limited value if an uncontrolled contact or warm ground plane dominates the reading.
Record averaging and conversion-cycle settings with the accuracy requirement. Eight conversions take about 124 ms typically in the timing diagram, while the conversion-cycle table rounds that active interval to 125 ms. A 1 s cycle leaves a standby interval between groups. A host reading every second should still check that it is using a completed conversion rather than assuming that the read command starts a new one.
The headline 3.5 µA typical current is specified at a 1 Hz cycle with averaging off, an inactive serial bus and 25°C. With eight averages at 1 Hz under the corresponding inactive-bus, 25°C condition, the electrical table instead gives 16 µA typical and 22 µA maximum. Do not combine the lowest current headline with a different averaging configuration when calculating power or self-heating.
The Data_Ready indication can identify a completed conversion or average. Reading the temperature or configuration register clears that flag. Immediately after reset, the temperature register contains 8000h, interpreted as −256°C, until the first conversion completes. Treat that as an initialization condition, not a plausible fixture temperature.
Test the actual bus workload as well. Other devices communicating on the same bus can increase sensor supply current, including in shutdown. A quiet laboratory test and a busy production controller can therefore create different electrical and thermal conditions. The required update interval, alert behavior and acceptable settling time should be explicit firmware requirements.
TMP116AIDRVR is a useful same-family comparison because TI identifies it as the standard TMP116 grade in the same six-pin DRV package. Its accuracy rows are shown above. Both identities and the common pin, register and interface descriptions were checked in the shared datasheet and the two official orderable pages. This is a precision-grade comparison, not a carrier-only alias.
A tighter grade can create more room for other errors, but it does not repair thermal coupling or automatically remove calibration work. Review the proposed substitution against the actual rail tolerance, operating range, footprint, assembly process and firmware configuration. Then repeat the fixture acceptance checks before adding it to the approved BOM. Procurement should retain the full OPN, so the N-grade requirement is not lost behind a family name.
A remote probe is a different architectural choice. If the object cannot be brought into a controlled thermal relationship with a board-mounted IC, selecting a more accurate local sensor may address the wrong problem. Assess the probe, interface and reference chain as a complete design instead of treating them as pin-compatible alternatives.
Use a documented reference comparison across the intended temperature range, supply corners, host workload and mounting conditions. Allow both the reference and the assembled fixture to reach a defined thermal equilibrium. Record the reference uncertainty and its current calibration status. Calibration practice must cover the measurement chain and the actual thermal setup, not only a nominal sensor specification. Kaye calibration guidance.
For illustration, suppose a team assigns the following absolute contributions for a fixture operating within the N-grade ±0.3°C row. These are hypothetical engineering allocations, not TI limits.
| Contribution | Illustrative allocation | Evidence needed before release |
|---|---|---|
| Sensor grade | ±0.30°C | Applicable TI accuracy row and test settings |
| Comparison reference | ±0.10°C | Reference specification, certificate and setup |
| Self-heating contribution | ±0.08°C | Actual rail, conversion mode and bus workload |
| Object-to-sensor thermal difference | ±0.12°C | Mounting, airflow and equilibrium comparison |
| Residual assembly/calibration contribution | ±0.04°C | Production-intent builds and repeat checks |
Table 2: Hypothetical fixture-error allocations for approval screening. Source: editorial engineering assumptions; sensor-grade row uses TI conditions above. Compiled by YG GROUP.
A conservative arithmetic sum of these assumed absolute contributions is ±0.64°C. That exceeds a hypothetical ±0.6°C system requirement. It is a screening calculation: the terms and possible overlap need engineering review, and they are not established independent random uncertainties suitable for automatic root-sum-square treatment. Use the result to decide which contribution must improve before approval.
Also define how calibration data and identity will be preserved. The device’s four general-purpose EEPROM words are factory programmed with its unique identification used for NIST traceability. TI says not to delete or reprogram those locations when that traceability is required. Do not casually use them for fixture offsets. Store corrections elsewhere if the original identity must remain intact. Component traceability does not certify the completed instrument or establish medical suitability.
Send YG GROUP the exact TMP116NAIDRVR OPN, Texas Instruments, quantity, required delivery date, reel or cut-tape requirement and requested lot or traceability documents. The TI ordering information identifies the large tape-and-reel option as 3,000 pieces; that does not establish a distributor’s order minimum or available quantity. State whether TMP116AIDRVR may be separately proposed for engineering review.
Attach the approved temperature and supply conditions and any assembly-sensitive requirements relevant to part approval. Confirm offer-specific availability, commercial terms and documents before committing the BOM. Request a quotation from YG GROUP.